FFC FPC dual contact connector DIANWEI 8.04A0.027200 1.0mm pitch compact side type back lock feature
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 27 Position 1mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
27P
Pitch:
1mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.04A0.027200
Package:
SMD,P=1mm,Surface Mount,Right Angle
Model Number:
8.04A0.027200
Introduction
Product Overview
The DIANWEI 8.04A series is a 1.0mm pitch FFC/FPC dual contact side connector with a height of 2.0mm. Designed for 0.3mm thick FFC/FPC cables, it features a back-lock mechanism and dual contact for reliable connections. This connector is suitable for applications requiring a compact and secure connection solution.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN CITY, CHINA
- Certifications: IATF16949, ISO9001:2015, ISO14001, UL 94V-0
Technical Specifications
| Attribute | Specification |
|---|---|
| Series | 8.04A |
| Pitch | 1.0mm |
| Connector Type | FFC/FPC dual contact side connector |
| Height (H) | 2.0mm |
| Applicable FFC/FPC Thickness | 0.3mm (4-40pin) |
| Housing Material | LCP Nature Color (UL 94V-0) |
| Cover Material | LCP Black (UL 94V-0) |
| Terminal Material | Copper Alloy |
| Stator Material | Copper Alloy |
| Contact Type | Double sides contact |
| Soldering Type | SMT |
| Plating Specification | Contact area and solder area gold plating 1~3u" |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10+50 |
| Storage Humidity | 2085%RH |
| Rating Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rating Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance | 30m Max |
| Insulation Resistance | 500M MIN |
| Dielectric Strength | No breakdown, no short circuit at 250V AC for 1 minute between adjacent terminals |
| Retention Force of single Pin | 0.2N / PIN MIN |
| Retention Force of GND Pin | 0.3N / PIN MIN |
| Retention Force of FFC/FPC | 0.3N Min/Pin (PIN Count X 0.3N Min) |
| Shock Resistance | Acceleration 490m/s, 11ms, 3 times in each of 6 directions |
| Vibration Resistance | Amplitude: 1.52mm, Frequency: 10~55~10Hz for 2 hours in each of 3 axes |
| Durability (Lock/Dis-lock) | 20 times |
| Heat Resistance | 852 for 96H |
| Humidity Resistance | 403, 90~95% RH for 96H |
| High/Low Temperature Cycling | 5 cycles |
| Salt Spray (Gold Plating) | 351, 5% salt water density for 48H |
| Solderability | Wetting by melted tin over 90% of dipping area at 2455 for 3sec |
| Resistance to Soldering Heat | Peak temperature: 260, over 230 for 305Sec. |
| Recommended Soldering Profile | Preheating: 150180 60~120Sec., Peak temperature: 2505, over 225 for 305Sec. (Lock cover shall be opened) |
2410121336_DIANWEI-8-04A0-027200_C19188850.pdf
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