Connector DIANWEI 8.01A0.030200 0.5mm pitch dual contact side type for FFC FPC cables 4 to 60 pins compatible
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
30P
Pitch:
0.5mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.01A0.030200
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
8.01A0.030200
Introduction
Product Overview
This specification applies to the 8.01A series, a 0.5mm pitch dual contact side connector for FFC/FPC with a height of 2.0mm. It features a rear-locking mechanism and is designed for 0.3mm thick FFC/FPC cables, supporting 4 to 60 pins. The connector offers dual-sided contact and is suitable for SMT soldering.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD
- Certifications: IATF16949, ISO9001:2015, ISO14001, National High-Tech Enterprise
- Housing Material: LCP Nature Color (UL 94V-0)
- Cover Material: LCP Black (UL 94V-0)
- Terminal Material: Copper Alloy
- Stator Material: Copper Alloy
Technical Specifications
| Spec Item | Parameter | Value | Unit | Notes |
| Series | Pitch | 0.5 | mm | FFC/FPC Dual Contact Side Connector (H=2.0mm) |
| Model | DIANWEI P/N | 8.01A0.XXX200 | ||
| Height (H) | 2.0 | mm | ||
| Applicable Cable Thickness | 0.3 | mm | 4-60pin | |
| Contact Type | Dual sides contact | |||
| Locking Mechanism | Rear-locking | Ensure lock cover is opened before SMT soldering or FPC insertion. | ||
| Soldering Type | SMT | |||
| Plating Specification | Contact & Solder Area | Gold plating 1~3u" | See drawing for details. | |
| Coplanarity | 0.10 | MAX | ||
| Operation Temperature | -40 ~ +85 | Without ice or dew. | ||
| Operation Humidity | 20-85 | %RH | ||
| Storage Temperature | -10 ~ +50 | Without ice or dew. | ||
| Storage Humidity | 20 ~ 85 | %RH | ||
| Rating Voltage | Ambient Temp 20 | 50 | V (AC/DC) | |
| Rating Current | Ambient Temp 20 | 0.5 | A / PIN | |
| Contact Resistance | Mate FPC, 20mV Max. DC, 100mA | 30 | m Max | |
| Insulation Resistance | 250V DC, 1 Minute (adjacent terminals) | 500 | M MIN | |
| Dielectric Strength | 250V AC, 1 Minute (adjacent terminals) | No Damage/Shorting | ||
| Retention Force (Single Pin) | Axial pull out, 25~100mm/Min | 0.2 | N / PIN MIN | |
| Retention Force (GND Pin) | Axial pull out, 25~100mm/Min | 0.3 | N / PIN MIN | |
| Retention Force (FFC/FPC) | Axial pull out, 20~100mm/Min | 0.3 | N Min/Pin | PIN Count X 0.3N Min |
| Shock Resistance | 490m/s, 11ms, 3 times/6 directions | 1sec Max. discontinuity; 50m MAX Contact Resistance; No Damage | FPC mated state | |
| Vibration Resistance | 1.52mm Amplitude, 10~55~10Hz, 2 hours/axis | 50m MAX Contact Resistance; No Damage | FPC mated state | |
| Durability (Lock/Dis-lock) | 20 times | 50m MAX Contact Resistance; No Damage | Loading condition | |
| Heat Resistance | 852 for 96H | 1sec Max. discontinuity; 50m MAX Contact Resistance; No damage; Retention force above 0.3N/Pin | FPC mated state, conditioned at ambient for 1H after exposure. | |
| Humidity Resistance | 403, 90~95% RH for 96H | 1sec Max. discontinuity; 50m Max Contact Resistance; 500 M Min Insulation Resistance; No damage/shorting; Visual ok | FPC mated state, conditioned at ambient for 1H after exposure. | |
| High/Low Temperature Cycle | 5 cycles | 1sec Max. discontinuity; 50 m Max Contact Resistance; Visual ok; Retention force above 0.3N/Pin | FPC mated state, conditioned at ambient for 1H after exposure. | |
| Salt Spray (Gold Plating) | 351, 5% salt water, 48H | No Corrosion | ||
| Solderability | Dip soldering tail, 2455, 3sec | Wetting over 90% of dipping area | ||
| Resistance to Soldering Heat | Preheat 150~180 (60~120s), Peak 2505 (over 230 for 305s) | 50m Max Contact resistance; No damage; Retention force above 0.3N/Pin | ||
| Recommended Soldering Profile | Preheat 150~180 (60~120s), Peak 2505 (over 225 for 305s) | Reference only, lock cover must be opened. |
2410121336_DIANWEI-8-01A0-030200_C19188804.pdf
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