FFC FPC dual contact side connector 1.0mm pitch 2.0mm height back locked mechanism DIANWEI 8.04A0.026200 model
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 26 Position 1mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
26P
Pitch:
1mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.04A0.026200
Package:
SMD,P=1mm,Surface Mount,Right Angle
Model Number:
8.04A0.026200
Introduction
Product Overview
This specification applies to the 8.04A series of 1.0mm pitch FFC/FPC dual contact side connectors with a height of 2.0mm. These connectors feature a back-locked mechanism suitable for 0.3mm thick FFC/FPC cables and are designed for SMT soldering. Key advantages include dual contact for reliable connection and a side-entry design. Caution is advised regarding the locking mechanism during SMT soldering to prevent product distortion and contact issues.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN, CHINA
- Certifications: IATF16949, ISO9001:2015, ISO14001, UL STD-94
Technical Specifications
| Specification | Details |
| Product Name | 1.0mm FFC/FPC dual contact side connector (H=2.0mm) |
| DIANWEI P/N | 8.04A0.XXX200 |
| Pitch | 1.0mm |
| Height (H) | 2.0mm |
| Applicable FFC/FPC Thickness | 0.3mm (4-40pin) |
| Housing Material | LCP Nature Color (UL 94V-0) |
| Cover Material | LCP Black (UL 94V-0) |
| Terminal Material | Copper Alloy |
| Stator Material | Copper Alloy |
| Contact Type | Dual contact, side contact |
| Locking Mechanism | Back-locked, Rotary lock |
| Soldering Type | SMT |
| Plating Specification | Contact area and solder area gold plating 1~3u |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 (without ice or dew) |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10 ~ +50 (without ice or dew) |
| Storage Humidity | 20 ~ 85%RH |
| Rating Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rating Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance | 30m Max (mated) |
| Insulation Resistance | 500M MIN (between adjacent terminals) |
| Dielectric Strength | 250V AC 1Minute (between adjacent terminals, no breakdown) |
| Retention Force of Single Pin | 0.2N / PIN MIN (axial pull out force) |
| Retention Force of GND Pin | 0.3N / PIN MIN (axial pull out force) |
| Retention Force of FFC/FPC | 0.3N Min/Pin (after insertion) |
| Shock Test | 490m/s, 11ms, 3 times per axis, 6 directions. Criteria: <1sec discontinuity, <50m contact resistance post-test. |
| Vibration Test | 1.52mm amplitude, 10~55~10Hz, 2 hours per axis (X/Y/Z). Criteria: <1sec discontinuity, <50m contact resistance post-test. |
| Durability Test | 20 cycles lock/dis-lock. Criteria: <50m contact resistance post-test. |
| Heat Resistance Test | 852 for 96H. Criteria: <1sec discontinuity, <50m contact resistance, <0.3N/Pin retention force post-test. |
| Humidity Test | 403, 90~95% RH for 96H. Criteria: <1sec discontinuity, <50m contact resistance, <500M insulation resistance, no breakdown/shorting, visual ok. |
| High/Low Temperature Cycling | 5 cycles. Criteria: <1sec discontinuity, <50m contact resistance, <0.3N/Pin retention force post-test. |
| Salt Spray Test (Gold Plating) | 5% salt water, 351, 48H. Criteria: No corrosion. |
| Solderability Test | Dip soldering tail at 2455 for 3sec. Criteria: Easy wetting, >90% tin coverage. |
| Resistance to Soldering Heat | Preheat 150~180 (60~120s), Peak 260, >230 (305s). Criteria: <50m contact resistance, <0.3N/Pin retention force post-test. |
| Recommended Soldering Profile | Preheat 150~180 (60~120s), Peak 2505, >225 (305s). Lock cover shall be opened during IR reflow. |
2410121336_DIANWEI-8-04A0-026200_C19188849.pdf
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