1.0mm pitch FFC FPC dual contact connector DIANWEI 8.04A0.016200 with back locking and SMT soldering
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 16 Position 1mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
16P
Pitch:
1mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.04A0.016200
Package:
SMD,P=1mm,Surface Mount,Right Angle
Model Number:
8.04A0.016200
Introduction
Product Overview
The DIANWEI 8.04A series is a 1.0mm pitch FFC/FPC dual contact side connector with a height of 2.0mm. Designed for 0.3mm thick FFC/FPC cables (4-40 pin), it features a back-locking mechanism. This connector is suitable for SMT soldering and offers dual contact for reliable connections. Key advantages include its compact design and robust performance under various environmental conditions.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN, China
- Certifications: IATF16949, ISO9001:2015, ISO14001, National High-tech Enterprise
Technical Specifications
| Specification | Details |
| Product Name | 1.0mm FFC/FPC dual contact side connector (H=2.0mm) |
| DIANWEI P/N | 8.04A0.XXX200 |
| Applicable Cable Thickness | 0.3mm |
| Pin Count | 4-40pin |
| Height (H) | 2.0mm |
| Material - Housing | LCP Nature Color (UL 94V-0) |
| Material - Cover | LCP Black (UL 94V-0) |
| Material - Terminal | Copper Alloy |
| Material - Stator | Copper Alloy |
| Contact Type | Dual contact |
| Soldering Type | SMT |
| FFC/FPC Thickness | 0.3 0.02mm |
| Plating | Contact area and solder area gold plating 1~3u |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10+50 |
| Storage Humidity | 2085%RH |
| Rated Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rated Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance (mated) | 30m Max |
| Insulation Resistance | 500M MIN (Apply 250V DC for 1 minute between adjacent terminals) |
| Withstanding Voltage | No breakdown, no short circuit (Apply 250V AC for 1 minute between adjacent terminals) |
| Retention Force of single Pin | 0.2N / PIN MIN |
| Retention Force of GND Pin | 0.3N / PIN MIN |
| Retention Force of FFC/FPC | 0.3N Min/Pin (PIN Count X 0.3N Min) |
| Shock Resistance | Acceleration 490m/s, 11ms, 3 times each of 6 directions. Discontinuity 1sec, Contact resistance 50m MAX after test. |
| Vibration Resistance | Amplitude: 1.52mm, Frequency: 10~55~10Hz for 2 hours each in 3 axes. Contact resistance 50m MAX after test. |
| Durability (lock/dis-lock) | 20 times. Contact resistance 50m MAX after test. |
| Heat Resistance | 96H at 852. Contact resistance 50m MAX, Retention force 0.3N/Pin after test. |
| Humidity Resistance | 96H at 403, 90~95% RH. Contact Resistance 50m Max, Insulation Resistance 500 M Min, Withstanding Voltage: No damage, Shorting after test. |
| High/Low Temperature Cycle | 5 cycles. Contact Resistance 50 m Max, Retention force 0.3N/Pin after test. |
| Salt Spray (Gold Plating) | 48H in 5% salt water density at 351. No corrosion after test. |
| Solderability | Dipped in tin oven at 2455 for 3 sec. Tin coverage 90% of dipping area. |
| Resistance to Soldering Heat | Preheating: 150180 60~120 sec. Soldering: Peak temp 260, >230 for 305 sec. Contact resistance 50m Max, Retention force 0.3N/Pin after test. |
| Recommended Soldering Profile | Preheating: 150180 60~120 sec. Soldering: Peak temp 2505, >225 for 305 sec. Lock cover shall be opened during SMT. |
2410121336_DIANWEI-8-04A0-016200_C19188844.pdf
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