SMT Termination Dual Contact Side Connector DIANWEI 8.01A0.004200 with 0.5mm Pitch and 2.0mm Height
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 4 Position 0.5mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
4P
Pitch:
0.5mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.01A0.004200
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
8.01A0.004200
Introduction
Product Overview
This specification applies to the 8.01A series, 0.5mm FFC/FPC dual contact side connectors with a height of 2.0mm. These connectors are designed for 0.3mm thick FFC/FPC cables and feature a dual contact side mechanism. They are suitable for applications requiring reliable electrical and mechanical performance under various environmental conditions.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD
- Certifications: IATF16949, ISO9001:2015, ISO14001, UL 94V-0
- Material: Housing: LCP Nature Color, Cover: LCP Black, Terminal: Copper Alloy, Stator: Copper Alloy
- Color: Black (Cover)
Technical Specifications
| Specification | Details |
|---|---|
| Series | 0.5mm Pitch FFC/FPC Dual Contact Side Connector (H=2.0mm) / 8.01A |
| Applicable Cable Thickness | 0.3mm 0.02mm |
| Number of Pins | 4-60pin |
| Connector Height (H) | 2.0mm |
| Contact Type | Dual sides contact |
| Termination Type | SMT |
| Plating Specification | Contact area and solder area gold plating 1~3, See drawing |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 (Without ice or dew) |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10 ~ +50 (Without ice or dew) |
| Storage Humidity | 20 ~ 85%RH |
| Rated Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rated Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance | 30m Max (mated) |
| Insulation Resistance | 500M MIN (between adjacent terminals, 250V DC for 1 minute) |
| Dielectric Strength | 250V AC for 1 minute (between adjacent terminals, No Damage/Shorting) |
| Retention Force of Single Pin | 0.2N / PIN MIN (axial pull out) |
| Retention Force of GND Pin | 0.3N / PIN MIN (axial pull out) |
| Retention Force of FFC/FPC | 0.3N Min/Pin (X 0.3N Min for total pins) |
| Shock Test | 490m/s, 11ms, 3 times per 6 directions. Criteria: 1sec Max. discontinuity, 50m MAX Contact resistance after test. |
| Vibration Test | 1.52mm Amplitude, 10~55~10Hz, 2 hours per 3 axes. Criteria: 1sec Max. discontinuity, 50m MAX Contact resistance after test. |
| Durability | 20 cycles lock/dis-lock. Criteria: 50m MAX Contact resistance, No Damage. |
| Heat Resistance Test | 852 for 96H. Criteria: 1sec Max. discontinuity, 50m MAX Contact resistance, No damage, Retention force above 0.3N/Pin. |
| Humidity Test | 403, 90~95% RH for 96H. Criteria: 1sec Max. discontinuity, 50m Max Contact Resistance, 500 M Min Insulation Resistance, No damage/shorting, Visual ok. |
| High/Low Temperature Cycle | 5 cycles. Criteria: 1sec Max. discontinuity, 50 m Max Contact Resistance, Visual ok, Retention force above 0.3N/Pin. |
| Salt Spray Test (Gold Plating) | 5% salt water, 351 for 48H. Criteria: No Corrosion. |
| Solderability | Dip in 2455 tin for 3sec. Criteria: Wetting over 90% of dipping area. |
| Resistance to Soldering Heat | Preheat 150180 60~120s, Peak temp. 2505, over 230 last 305s. Criteria: Contact resistance 50m Max., No damage, Retention force above 0.3N/Pin. |
| Recommended Soldering Profile | Preheat: 150180 60~120s, Peak temp. 2505, over 225 last 305s. Lock cover shall be opened during IR reflow. |
2410121336_DIANWEI-8-01A0-004200_C19188789.pdf
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