High Density FFC FPC Connector DIANWEI 8.01A0.034200 Dual Contact Side 0.5mm Pitch with Rear Locking
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 34 Position 0.5mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
34P
Pitch:
0.5mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.01A0.034200
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
8.01A0.034200
Introduction
Product Overview
The DIANWEI 0.5mm FFC/FPC Dual Contact Side Connector (H=2.0mm) is a high-density connector designed for reliable data transmission. Featuring a dual contact design and a rear-locking mechanism, it ensures secure FPC/FFC insertion and retention. This connector is suitable for applications requiring a compact design with a 0.5mm pitch and a 2.0mm height, compatible with 0.3mm thick FFC/FPC cables.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD, China
- Certifications: IATF16949, ISO9001:2015, ISO14001, National High-Tech Enterprise
- Material: Housing: LCP (UL 94V-0), Cover: LCP (UL 94V-0), Terminal: Copper Alloy, Stator: Copper Alloy
- Color: Housing: Nature Color, Cover: Black
Technical Specifications
| Spec | Description | Value |
| Series | 0.5mm FFC/FPC Dual Contact Side Connector (H=2.0mm) | 8.01A |
| Pitch | 0.5mm | |
| Connector Height | 2.0mm | |
| Applicable FFC/FPC Thickness | 0.3mm 0.02mm | |
| Contact Type | Dual sides contact | |
| Locking Mechanism | Rear-locking | |
| Termination Type | SMT | |
| Plating Specification | Contact area and solder area gold plating 1~3u | |
| Coplanarity | 0.10mm MAX | |
| Operation Temperature | -40 ~ +85 | |
| Operation Humidity | 20-85RH | |
| Storage Temperature | -10+50 | |
| Storage Humidity | 2085%RH | |
| Rating Voltage | 50V (AC/DC) at 20 ambient temperature | |
| Rating Current | 0.5A / PIN at 20 ambient temperature | |
| Contact Resistance | 30m Max | Mate applicable FPC and measure by dry circuit, 20mV Max. DC, 100mA. |
| Insulation Resistance | 500M MIN | Apply 250V DC for 1 Minute between adjacent terminals. |
| Dielectric Strength | No Damage/Shorting | Apply 250V AC for 1 Minute between adjacent terminals. |
| Retention Force (Single Pin) | 0.2N / PIN MIN | Apply axial pull out force at the rate of 25~100mm/Min. |
| Retention Force (GND Pin) | 0.3N / PIN MIN | Apply axial pull out force at the rate of 25~100mm/Min. |
| Retention Force (FFC/FPC) | 0.3N Min/Pin (PIN Count X 0.3N Min) | Inserted FFC into connector, apply axial pull out force at the rate of 20~100mm/Min. |
| Shock Resistance | No discontinuity > 1sec, Contact resistance 50m MAX, No Damage | Test speed 490m/s, duration 11ms, 3 times of shocks in each of 6 directions along 3 mutually perpendicular axes. FPC mated state. |
| Vibration Resistance | Contact resistance 50m MAX, No Damage | Amplitude: 1.52mm, Frequency: 10~55~10Hz in 1 minute. X/Y/Z directions for 2 hours each. FPC mated state. |
| Durability (Lock/Dis-lock) | Contact resistance 50m MAX, No Damage | 20 cycles with loading. |
| Heat Resistance | No discontinuity > 1sec, Contact resistance 50m MAX, No damage, Retention force 0.3N/Pin | Expose to 852 for 96H, conditioned at ambient for 1H. FPC mated state. |
| Humidity Resistance | No discontinuity > 1sec, Contact Resistance 50m Max, Insulation Resistance 500 M Min, Dielectric: No damage/Shorting, Visual ok | Expose to 403, 90~95% RH for 96H, conditioned at ambient for 1H. FPC mated state. |
| High/Low Temperature Cycle | No discontinuity > 1sec, Contact Resistance 50 m Max, Visual ok, Retention force 0.3N/Pin | 5 cycles based on specified temperature profile, conditioned at ambient for 1H. FPC mated state. |
| Salt Spray (Gold Plating) | No Corrosion | Expose to 5% salt water density at 351 for 48H. |
| Solderability | Soldering tail shall be easy wetting by melted tin, Tin coverage 90% | Dip soldering tail into Tin oven at 2455 for 3sec. |
| Resistance to Soldering Heat | Contact resistance 50m Max, No damage, Retention force 0.3N/Pin | Preheating: 150180 for 60~120Sec. Soldering: Peak temperature 2505, over 230 for 305Sec. |
| Recommended Soldering Profile | Refer to profile, lock cover shall be opened during IR reflow | Preheating: 150180 for 60~120Sec. Soldering: Peak temperature 2505, over 225 for 305Sec. |
2410121336_DIANWEI-8-01A0-034200_C19188805.pdf
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