1.0mm pitch FFC FPC connector DIANWEI 8.04A0.028200 dual contact side with rear locking mechanism
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
28P
Pitch:
1mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.04A0.028200
Package:
SMD,P=1mm,Surface Mount,Right Angle
Model Number:
8.04A0.028200
Introduction
Product Overview
The DIANWEI 8.04A series is a 1.0mm pitch FFC/FPC dual contact side connector with a height of 2.0mm. Designed for 0.3mm thick cables, it features a rear-locking mechanism suitable for SMT processes. This connector ensures reliable electrical and mechanical performance, meeting stringent industry standards.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD
- Certifications: IATF16949, ISO9001:2015, ISO14001, UL STD-94
- Material: Housing: LCP Nature Color (UL 94V-0), Cover: LCP Black (UL 94V-0), Terminal: Copper Alloy, Stator: Copper Alloy
- Color: Nature (Housing), Black (Cover)
Technical Specifications
| Specification | Details |
| Product Series | 8.04A |
| Pitch | 1.0mm |
| Connector Type | FFC/FPC dual contact side connector |
| Height (H) | 2.0mm |
| Applicable Cable Thickness | 0.3mm (0.02mm) |
| Applicable Pin Count | 4-40pin |
| Locking Mechanism | Rear-locked (SMT back locked Type) |
| Contact Type | Double sides contact |
| Termination Style | SMT |
| Plating Specification | Contact area and solder area gold plating 1~3u |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 (without ice or dew) |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10 ~ +50 (without ice or dew) |
| Storage Humidity | 20 ~ 85%RH |
| Rating Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rating Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance | 30m Max (mated) |
| Insulation Resistance | 500M MIN (at 250V DC for 1 minute between adjacent terminals) |
| Dielectric Strength | No breakdown or short circuit (at 250V AC for 1 minute between adjacent terminals) |
| Retention Force of Single Pin | 0.2N / PIN MIN |
| Retention Force of GND Pin | 0.3N / PIN MIN |
| Retention Force of FFC/FPC | 0.3N Min/Pin (after insertion) |
| Shock Resistance | 490m/s, 11ms, 3 times per axis (6 directions) - No discontinuity > 1sec, Contact resistance 50m, No damage |
| Vibration Resistance | 1.52mm amplitude, 10~55~10Hz frequency, 2 hours per axis (3 axes) - No discontinuity > 1sec, Contact resistance 50m, No damage |
| Durability (Lock/Dis-lock) | 20 times - Contact resistance 50m, No damage |
| Heat Resistance | 96H at 852 - No discontinuity > 1sec, Contact resistance 50m, No damage, Retention force 0.3N/Pin |
| Humidity Resistance | 96H at 403, 90~95% RH - No discontinuity > 1sec, Contact resistance 50m, Insulation resistance 500M, No dielectric breakdown/shorting, Visual ok |
| High/Low Temperature Cycle | 5 cycles - No discontinuity > 1sec, Contact resistance 50m, Visual ok, Retention force 0.3N/Pin |
| Salt Spray (Gold Plating) | 48H at 351, 5% salt water density - No corrosion |
| Solderability | Wetting by melted tin 90% of dipping area (at 2455 for 3 sec) |
| Resistance to Soldering Heat | Peak temp: 260, over 230 for 305 sec - Contact resistance 50m, No damage, Retention force 0.3N/Pin |
| Recommended Soldering Profile | Preheat: 150~180 (60~120 sec), Peak temp: 2505, over 225 for 305 sec (Lock cover shall be opened) |
2410121336_DIANWEI-8-04A0-028200_C19188851.pdf
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