1.0mm Pitch FFC FPC Connector DIANWEI 8.04A0.030200 Featuring Back Lock Cover for Secure Connection
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 30 Position 1mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
30P
Pitch:
1mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.04A0.030200
Package:
SMD,P=1mm,Surface Mount,Right Angle
Model Number:
8.04A0.030200
Introduction
Product Overview
The DIANWEI 8.04A series is a 1.0mm pitch FFC/FPC dual contact side connector with a height of 2.0mm. Designed for 0.3mm thick FFC/FPC cables (4-40 pin), this connector features a back-locking mechanism that requires the lock cover to be opened before SMT soldering or FPC insertion to prevent potential issues like difficult insertion, connector distortion, or contact problems. It is suitable for applications requiring reliable electrical and mechanical performance.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD
- Certifications: IATF16949, ISO9001:2015, ISO14001, UL 94V-0
- Housing Material: LCP Nature Color (UL 94V-0)
- Cover Material: LCP Black (UL 94V-0)
- Terminal Material: Copper Alloy
- Stator Material: Copper Alloy
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | 1.0mm FFC/FPC dual contact side connector (H=2.0mm) |
| Series/Model | 8.04A |
| Pitch | 1.0mm |
| Height (H) | 2.0mm |
| Applicable FFC/FPC Thickness | 0.3mm 0.02mm |
| Applicable Pin Count | 4-40pin |
| Contact Type | Dual contact side connector |
| Locking Mechanism | Back-locked (Rotary lock) |
| Soldering Type | SMT |
| Coplanarity | 0.10mm MAX |
| Plating Specification | Contact area and solder area gold plating 1~3u |
| Operation Temperature | -40 to +85 (without ice or dew) |
| Operation Humidity | 20-85% RH |
| Storage Temperature | -10 to +50 (without ice or dew) |
| Storage Humidity | 20-85% RH |
| Rating Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rating Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance (mated) | 30m Max. |
| Insulation Resistance | 500M MIN (between adjacent terminals, 250V DC, 1 min) |
| Dielectric Strength | No breakdown or short circuit (between adjacent terminals, 250V AC, 1 min) |
| Retention Force of Single Pin | 0.2N / PIN MIN (axial pull out) |
| Retention Force of GND Pin | 0.3N / PIN MIN (axial pull out) |
| Retention Force of FFC/FPC | 0.3N Min/Pin (axial pull out after insertion) |
| Shock Resistance | 490m/s, 11ms, 3 times per 6 directions; Contact resistance 50m MAX after test. |
| Vibration Resistance | 1.52mm amplitude, 10~55~10Hz frequency, 2 hours per 3 axes; Contact resistance 50m MAX after test. |
| Durability (Lock/Dis-lock) | 20 times with loading; Contact resistance 50m MAX after test. |
| Heat Resistance | 96H at 852; Contact resistance 50m MAX, Retention force 0.3N/Pin after test. |
| Humidity Resistance | 96H at 403, 90-95% RH; Contact resistance 50m Max, Insulation Resistance 500 M Min, Dielectric: No damage/shorting after test. |
| High/Low Temperature Cycling | 5 cycles based on specified table; Contact resistance 50 m Max, Retention force 0.3N/Pin after test. |
| Salt Spray (Gold Plating) | 48H in 5% salt water at 351; No corrosion after test. |
| Solderability | Wetting by melted tin over 90% of dipping area at 2455 for 3 sec. |
| Resistance to Soldering Heat | Peak temp: 260, over 230 last 305 sec; Contact resistance 50m Max, Retention force 0.3N/Pin after test. |
| Recommended Soldering Profile | Preheating: 150180 60~120 sec; Peak: 2505, over 225 last 305 sec. Lock cover must be opened during SMT. |
2410121336_DIANWEI-8-04A0-030200_C19188852.pdf
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