0.5mm pitch dual contact side connector DIANWEI 8.01A0.045200 suitable for 0.3mm thick FFC FPC cables
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 45 Position 0.5mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
45P
Pitch:
0.5mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.01A0.045200
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
8.01A0.045200
Introduction
Product Overview
The 0.5mm pitch dual contact side connector (H=2.0mm) from DIANWEI Technology is designed for FFC/FPC applications. This connector features a rear-locking mechanism and dual contact points for reliable connections. It is suitable for 0.3mm thick FFC/FPC cables and supports a wide range of pin counts from 4 to 60.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD, China
- Certifications: IATF16949, ISO9001:2015, ISO14001,
- Material: Housing: LCP Nature Color (UL 94V-0), Cover: LCP Black (UL 94V-0), Terminal: Copper Alloy, Stator: Copper Alloy
- Color: Housing: Nature, Cover: Black
Technical Specifications
| Item | Specification | Details |
| Product Series | FFC/FPC Dual Contact Side Connector | H=2.0mm, PITCH 0.5mm, Series 8.01A |
| Mechanism | Rear Locking | Dual contact side connector |
| Applicable Cable Thickness | 0.3mm | 0.02mm |
| Pin Count | 4-60 Pin | Specific counts available: 4P, 6P, 10P, 12P, 14P, 18P, 24P, 30P |
| Contact Type | Double Sides Contact | |
| Soldering Type | SMT | |
| Plating Specification | Contact area and solder area gold plating | 1~3u", See drawing |
| Coplanarity | 0.10mm MAX | |
| Operation Temperature | -40 ~ +85 | Without ice or dew |
| Operation Humidity | 20-85RH | |
| Storage Temperature | -10+50 | Without ice or dew |
| Storage Humidity | 2085%RH | |
| Rating Voltage | 50V (AC/DC) | Ambient temperature 20 |
| Rating Current | 0.5A / PIN | Ambient temperature 20 |
| Contact Resistance | 30m Max | Mate applicable FPC, measure by dry circuit, 20mV Max. DC, 100mA |
| Insulation Resistance | 500M MIN | Apply 250V DC 1Minutes between adjacent terminals |
| Dielectric Strength | No Damage/Shorting | Apply 250V AC 1Minutes between adjacent terminals |
| Retention Force of Single Pin | 0.2N / PIN MIN | Apply axial pull out force at the rate of 25~100mm/Min |
| Retention Force of GND Pin | 0.3N / PIN MIN | Apply axial pull out force at the rate of 25~100mm/Min |
| Retention Force of FFC/FPC | 0.3N Min/Pin | Insert FFC, apply axial pull out force at the rate of 20~100mm/Min (Total: PIN Count X 0.3N Min) |
| Shock Resistance | No discontinuity > 1sec, Contact resistance 50m MAX, No Damage | Test speed 490m/s, 11ms, 3 times in each of 6 directions |
| Vibration Resistance | No discontinuity > 1sec, Contact resistance 50m MAX, No Damage | Amplitude: 1.52mm, Frequency: 10~55~10Hz, 2 hours in each of 3 axes |
| Durability | No discontinuity > 1sec, Contact resistance 50m MAX, No Damage | Lock/dis-lock 20 times with loading |
| Heat Resistance | No discontinuity > 1sec, Contact resistance 50m MAX, No damage, Retention force > 0.3N/Pin | Expose to 852 for 96H, then condition at ambient for 1H |
| Humidity Resistance | No discontinuity > 1sec, Contact Resistance: 50m Max, Insulation Resistance: 500 M Min, Dielectric: No damage/shorting, Visual ok | Expose to 403, 90~95% RH for 96H, then condition at ambient for 1H |
| High/Low Temperature Cycle | No discontinuity > 1sec, Contact Resistance: 50 m Max, Visual ok, Retention force > 0.3N/Pin | 5 cycles based on specified table, then condition at ambient for 1H |
| Salt Spray (Gold Plating) | No Corrosion | Expose to 5% salt water density at 351 for 48H |
| Solderability | Soldering tail easy wetting, Tin cover > 90% | Dip soldering tail into Tin oven at 2455 for 3sec |
| Resistance to Soldering Heat | Contact resistance 50m Max., no damage, Retention force > 0.3N/Pin | Preheat: 150~180 60~120s, Peak temp: 2505, >230 last 305s |
| Recommended Soldering Profile | Refer to document | Preheat: 150~180 60~120s, Peak temp: 2505, >225 last 305s (Lock cover shall be opened during IR reflow) |
2410121336_DIANWEI-8-01A0-045200_C19188811.pdf
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