0.5mm Pitch FFC FPC Dual Contact Side Connector DIANWEI 8.01A0.026200 with Rear Locking Mechanism
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 26 Position 0.5mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
26P
Pitch:
0.5mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.01A0.026200
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
8.01A0.026200
Introduction
Product Overview
The 0.5mm FFC/FPC dual contact side connector (H=2.0mm) from DIANWEI Technology is designed for reliable connections with 0.3mm thick FFC/FPC cables, supporting 4 to 60 pins. This connector features a rear-locking mechanism and dual-sided contact for enhanced performance and stability. It is suitable for applications requiring robust electrical and mechanical characteristics.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD
- Certifications: IATF16949, ISO9001:2015, ISO14001,
- Materials: Housing: LCP Nature Color (UL 94V-0), Cover: LCP Black (UL 94V-0), Terminal: Copper Alloy, Stator: Copper Alloy
- Color: Black (Cover)
Technical Specifications
| Attribute | Specification |
| Product Series | 8.01A |
| Pitch | 0.5mm |
| Connector Type | FFC/FPC Dual Contact Side Connector |
| Height (H) | 2.0mm |
| Applicable Cable Thickness | 0.3mm |
| Applicable Pins | 4-60pin |
| Locking Mechanism | Rear-locking |
| Contact Type | Dual sides contact |
| Terminal Soldering Type | SMT |
| Applicable PCB Thickness | T=0.30.02mm |
| Plating Specification | Contact area and solder area gold plating 1~3u |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10+50 |
| Storage Humidity | 2085%RH |
| Rating Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rating Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance | 30m Max |
| Insulation Resistance | 500M MIN |
| Dielectric Strength | 250V AC 1Minute between adjacent terminals (No Damage/Shorting) |
| Retention Force of single Pin | 0.2N / PIN MIN |
| Retention force of GND Pin | 0.3N / PIN MIN |
| Retention force of FFC/FPC | 0.3N Min/Pin (PIN X 0.3N Min) |
| Shock Resistance | Acceleration 490m/s, 11ms, 3 times per 6 directions. Contact resistance 50m MAX after test. |
| Vibration Resistance | Amplitude: 1.52mm, Frequency: 10~55~10Hz for 2 hours in each of 3 axes. Contact resistance 50m MAX after test. |
| Durability (Lock/Dis-lock) | 20 times. Contact resistance 50m MAX after test. |
| Heat Resistance | 852 for 96H. Contact resistance 50m MAX, Retention force is above 0.3N/Pin after test. |
| Humidity Resistance | 403, 90~95% RH for 96H. Contact resistance 50m Max, Insulation Resistance 500 M Min after test. |
| High/Low Temperature Cycling | 5 cycles. Contact Resistance: 50 m Max, Retention force is above 0.3N/Pin after test. |
| Salt Spray (Gold Plating) | 351, 5% salt water density for 48H. No Corrosion. |
| Solderability | Dip soldering tail into Tin oven at 2455 for 3sec. Over 90% wetting. |
| Resistance to soldering heat | Pre-heating: 150180 60~120 sec. Peak temp: 2505, over 230 last 305 sec. Contact resistance 50m Max., Retention force is above 0.3N/Pin after test. |
| Recommended Soldering Profile | Pre-heating: 150180 60~120 sec. Peak temp: 2505, over 225 last 305 sec. Lock cover shall be opened during IR reflow. |
2410121336_DIANWEI-8-01A0-026200_C19188802.pdf
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