Micro USB Connector Hanxia HX MICRO 4PCB1.0 JB with C5191 Nickel Base and Gold Plated Contact Terminal
Specifications
Mounting Type:
沉板
Connector Type:
Micro-B
Gender:
母
Mfr. Part #:
HX MICRO 4PCB1.0 JB
Package:
SMD
Model Number:
HX MICRO 4PCB1.0 JB
Introduction
Product Overview
This document outlines the specifications for the HX MICRO 4PCB1.0 JB, a Micro USB connector manufactured by Shenzhen Hanxia Electronic Co., Ltd. It details the material composition, mechanical, electrical, and environmental performance standards to ensure product quality and reliability.
Product Attributes
- Brand: HX MICRO
- Model: 4PCB1.0 JB
- Origin: Shenzhen, China
- Manufacturer: Shenzhen Hanxia Electronic Co., Ltd
- Certifications: UL94V-0 (for LCP material)
Technical Specifications
| Section | Item | Specification | Test Method/Reference Standard |
| Material Details | Plastic Part | LCP UL94V-0 | |
| Contact Terminal Part | C5191, Nickel base, Gold plated contact area 1 | ||
| Shell Part | H65 EH, Nickel plated base shell 60 | ||
| Mechanical Performance | Insertion Force | 3.0kgf MAX | Reference: EIA 364-13A |
| Extraction Force | 0.7~1.8 kgf MIN | Reference: EIA 364-13A | |
| Single PIN Retention Force | 0.5 kgf MIN | Reference: EIA 364-23A | |
| Durability | 5000 cycles | Uniform speed insertion/extraction at 600 cycles/hour. Reference: EIA 364-09A | |
| Electrical Performance | Contact Resistance | 50m MAX | Test with low power current. Reference: EIA 364-21A |
| Insulation Resistance | 100M MIN | Test plastic impedance between adjacent contact pins. Reference: EIA 364-20A | |
| Withstanding Voltage | 300V AC 1 minute 0.5mA MAX | Test high voltage resistance between plastic pins. Reference: EIA 364-20A | |
| Environmental Performance | Solderability | Tin coverage reaches 95% or more | Product welding area immersed in tin bath at 2355 for 50.5 seconds. Reference: MIL STD-202F |
| High Temperature Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | Place product in 85 oven for 96 hours, then at room temperature for 3 hours. Reference: MIL STD-1344A | |
| Low Temperature Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | Place product in -40 oven for 96 hours, then at room temperature for 3 hours. Reference: MIL STD-1344A | |
| Moisture Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | Place product in 402, 9095RH environment for 120 hours. Reference: EIA 364-31A | |
| Corrosion Resistance | Appearance: No obvious corrosion. Contact Resistance: 50m MAX. | Place product in salt spray chamber with 5% salt water concentration at 352 for continuous spraying for 12 hours. Reference: EIA 364-26A | |
| Vibration Test | Appearance: No obvious discoloration or blistering. Solder tail tinning smooth. | Continuous testing in X/Y/Z directions for 2 hours each, with frequency from 10HZ to 55HZ and back to 10HZ per minute. Amplitude 1.5mm. Reference: EIA 364-28A |
2309141107_hanxia-HX-MICRO-4PCB1-0-JB_C7502828.pdf
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