Electronic Connector hanxia HX MICRO 4PCB1.6 JB with C5191 Gold Plated Contact and Nickel Base Shell
Specifications
Mounting Type:
沉板
Connector Type:
Micro-B
Gender:
母
Mfr. Part #:
HX MICRO 4PCB1.6 JB
Package:
SMD
Model Number:
HX MICRO 4PCB1.6 JB
Introduction
Product Overview
The HX MICRO 4PCB1.6 JB is a Micro USB connector designed for reliable electronic applications. It offers robust mechanical, environmental, and electrical performance, ensuring consistent connectivity in various operating conditions.
Product Attributes
- Brand: Shenzhen Hanxia Electronic Co., Ltd
- Origin: Shenzhen, China
- Material: LCP (UL94V-0), C5191 (Nickel base, Gold plated contact), H65 EH (Nickel plated shell)
- Certifications: UL94V-0
Technical Specifications
| Item | Specification | Test Method/Reference Standard |
| Material Details | ||
| Plastic Part | LCP UL94V-0 | |
| Contact Terminal | C5191, Nickel base, Gold plated contact 1 | |
| Shell Part | H65 EH, Nickel plated shell 60 | |
| Mechanical Performance | ||
| Insertion Force | 3.0kgf MAX | EIA 364-13A (Insertion speed: 25mm/min) |
| Withdrawal Force | 0.7~1.8 kgf | EIA 364-13A (Withdrawal speed: 25mm/min) |
| Terminal Single PIN Retention Force | 0.5 kgf MIN | EIA 364-13A (Force to withdraw contact pin from plastic) |
| Durability | 5000 cycles | EIA 364-09A (Mating/Unmating cycles) |
| Vibration Test | Amplitude 1.5mm, 10Hz-55Hz-10Hz cycle, 2 hours per X/Y/Z direction | EIA 364-28A |
| Electrical Performance | ||
| Contact Resistance | 50m MAX | EIA 364-23A (Low power current test) |
| Insulation Resistance | 100M MIN @ 100V DC | EIA 364-21A (Measure impedance between adjacent contact pins) |
| Withstand Voltage | 300V AC 1 minute, 0.5mA MAX | EIA 364-20A (Test high voltage between contact pins for 1 minute) |
| Environmental Performance | ||
| Tinning Property | Tin coverage 95% | MIL STD-202F (Product welding area immersed in 2355 tin bath for 50.5 seconds) |
| High Temperature Resistance | Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN | MIL STD-1344A (Product placed in 85 oven for 96 hours, then at room temperature for 3 hours) |
| Low Temperature Resistance | Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN | MIL STD-1344A (Product placed in -40 oven for 96 hours, then at room temperature for 3 hours) |
| Humidity Resistance | Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN | EIA 364-31A (Product placed in 402, 90-95%RH environment for 120 hours) |
| Corrosion Resistance | Appearance: No obvious corrosion; Contact Resistance: 50m MAX | EIA 364-26A (Product placed in 5% salt solution at 352 for 12 hours, then at room temperature for 1 hour) |
| Solderability | Appearance: No obvious discoloration or blistering; Solderable area: Smooth | |
| Operating Conditions | ||
| Working Current | 1.8 Ampere | |
| Operating Temperature | -30 ~ +80 |
2309141107_hanxia-HX-MICRO-4PCB1-6-JB_C7502829.pdf
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