Micro USB connector model hanxia HX MICRO 4PCB0.8 ZB with gold plated contacts and nickel plated shell
Specifications
Mounting Type:
沉板
Connector Type:
Micro-B
Gender:
母
Mfr. Part #:
HX MICRO 4PCB0.8 ZB
Package:
SMD
Model Number:
HX MICRO 4PCB0.8 ZB
Introduction
Product Overview
This document outlines the specifications for the HX MICRO 4PCB0.8 ZB, a Micro USB connector manufactured by Shenzhen Hanxia Electronic Co., Ltd. It details the material composition, mechanical, electrical, and environmental performance standards, along with testing methods and acceptance criteria.
Product Attributes
- Brand: HX MICRO
- Origin: Shenzhen, China
- Manufacturer: Shenzhen Hanxia Electronic Co., Ltd
- Model: HX MICRO 4PCB0.8 ZB
- Connector Type: Micro USB
Technical Specifications
| Section | Item | Specification | Test Method/Reference |
|---|---|---|---|
| Material Details | Plastic Part | LCP UL94V-0 | |
| Contact Terminal Part | C5191, Nickel base, Gold plated contact area 1 | ||
| Shell Part | H65 EH, Nickel plated base 60 | ||
| Working Conditions | Working Current | 1.8Ampere | |
| Operating Temperature | -30+80 | ||
| Mechanical Performance | Insertion Force | 3.0kgf MAX | Refer to EIA 364-13A |
| Extraction Force | 0.7~1.8 kgf | Refer to EIA 364-13A | |
| Single Pin Retention Force | 0.5 kgf MIN | Refer to EIA 364-13A | |
| Durability | 5000 cycles | Uniform speed 600 cycles/hour, Refer to EIA 364-09A | |
| Electrical Performance | Contact Resistance | 50m MAX | Test with low power current, Refer to EIA 364-23A |
| Insulation Resistance | 100M MIN | Test between adjacent contact pins, Refer to EIA 364-21A | |
| Withstand Voltage | 300V AC 1 minute 0.5mA MAX | Test plastic impedance between adjacent contact pins, Refer to EIA 364-20A | |
| Environmental Performance | Solderability | Tinning area 95% | Product welding area immersed in 2355 tin bath for 50.5 seconds, Refer to MIL STD-202F |
| High Temperature Resistance | Appearance no obvious damage, Contact resistance 100m, Insulation resistance 100M | Place product in 85 oven for 96 hours, then 3 hours at room temperature, Refer to MIL STD-1344A | |
| Low Temperature Resistance | Appearance no obvious damage, Contact resistance 100m, Insulation resistance 100M | Place product in -40 oven for 96 hours, then 3 hours at room temperature, Refer to MIL STD-1344A | |
| Humidity Resistance | Appearance no obvious damage, Contact resistance 100m, Insulation resistance 100M | Place product in 402, 9095RH environment for 120 hours, Refer to EIA 364-31A | |
| Corrosion Resistance | Appearance no obvious corrosion, Contact resistance 50m MAX | Place product in salt spray chamber with 5% salt water concentration, 352 for 12 hours spray, then 1 hour at room temperature, Refer to EIA 364-26A | |
| Solder Heat Resistance | Appearance no obvious discoloration/bubbling; Solder joints smooth | Product welding area immersed in 2355 tin bath for 50.5 seconds, Refer to MIL STD-202F | |
| Vibration Test | Continuous test for 2 hours in X/Y/Z directions, frequency 10Hz to 55Hz and back to 10Hz per minute, Amplitude 1.5mm | Refer to EIA 364-28A |
2309141107_hanxia-HX-MICRO-4PCB0-8-ZB_C7502825.pdf
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