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Micro USB connector hanxia HX MICRO 6.4 JBWZ with tin plated shell and gold plated contact terminals

Manufacturer:
hanxia
Description:
USB-Micro B Receptacle Connector Surface Mount, Right Angle
Category:
USB, DVI, HDMI Connector Adapters/USB, DVI, HDMI Connector Assemblies
Specifications
Mounting Type:
卧贴
Connector Type:
Micro-B
Gender:
Mfr. Part #:
HX MICRO 6.4 JBWZ
Package:
SMD
Model Number:
HX MICRO 6.4 JBWZ
Introduction

Product Overview

This document outlines the specifications for the HX MICRO 6.4 JBWZ, a Micro USB connector manufactured by Shenzhen Hanxia Electronic Co., Ltd. It details the material composition, mechanical, electrical, and environmental performance requirements for the product.

Product Attributes

  • Brand: HX MICRO
  • Origin: Shenzhen Hanxia Electronic Co., Ltd
  • Model: HX MICRO 6.4 JBWZ
  • Certifications: UL94V-0 (for LCP plastic)

Technical Specifications

SectionItemSpecificationTest Method/Reference Standard
Material DetailsPlastic PartLCP UL94V-0
Contact Terminal PartH65, Nickel base, Gold plated contact area 1
Shell PartH65, Nickel base 50, Tin plated 80
Mechanical PerformanceInsertion Force3.0kgf MAXReference: EIA 364-13A (Insertion force when mating with cable end at 25mm/min)
Extraction Force0.7~1.8 kgfReference: EIA 364-13A (Extraction force when mating with cable end at 25mm/min)
Terminal Single PIN Retention Force0.5 kgf MINReference: EIA 364-09A (Force to withdraw contact PIN from plastic at 25mm/min)
Durability Test3000 cyclesReference: EIA 364-28A (Uniform insertion/extraction at 600 cycles per hour)
Electrical PerformanceContact Resistance50m MAXReference: EIA 364-23A (Test contact resistance value with low power current)
Insulation Resistance100M MIN100V DC
Withstanding Voltage Test300V AC 1 minute 0.5mAReference: EIA 364-20A (Test plastic withstand voltage between contact pins for 1 minute with 0.5mA current)
Plastic Impedance between Adjacent Contact PinsReference: EIA 364-21A (Test plastic impedance value between adjacent contact pins)
Contact Resistance (after environmental tests)100m MAX
Insulation Resistance (after environmental tests)100M MIN
Environmental PerformanceSolderabilityTin coverage 95%Product welding area immersed in 2355 tin bath for 50.5 seconds. Reference: MIL STD-202F
High Temperature ResistanceAppearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.Place product in 85 high-temperature oven for 96 hours, then place at room temperature for 3 hours for observation. Reference: MIL STD-1344A
Low Temperature ResistanceAppearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.Place product in -40 low-temperature oven for 96 hours, then place at room temperature for 3 hours for observation. Reference: MIL STD-1344A
Humidity ResistanceAppearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.Place product in an environment of 402 and 9095%RH for 120 hours, then observe. Reference: EIA 364-31A
Corrosion ResistanceAppearance: No obvious corrosion. Contact Resistance: 50m MAX.Place product in a salt spray chamber with 5% salt water concentration at 352 for continuous spray for 12 hours, then place at room temperature for 1 hour for observation. Reference: EIA 364-26A
Solderability (after environmental tests)Appearance: No obvious discoloration or blistering; Solder on solder legs is smooth.
OtherWorking Current1 Ampere
Operating Temperature-30+80
Vibration TestAmplitude 1.5mm, frequency from 10Hz to 55Hz and back to 10Hz per minute, continuous testing for 2 hours in X/Y/Z directions.Reference: EIA 364-28A

2309141107_hanxia-HX-MICRO-6-4-JBWZ_C7502815.pdf

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