Micro USB connector hanxia HX MICRO 6.4 JBWZ with tin plated shell and gold plated contact terminals
Specifications
Mounting Type:
卧贴
Connector Type:
Micro-B
Gender:
母
Mfr. Part #:
HX MICRO 6.4 JBWZ
Package:
SMD
Model Number:
HX MICRO 6.4 JBWZ
Introduction
Product Overview
This document outlines the specifications for the HX MICRO 6.4 JBWZ, a Micro USB connector manufactured by Shenzhen Hanxia Electronic Co., Ltd. It details the material composition, mechanical, electrical, and environmental performance requirements for the product.
Product Attributes
- Brand: HX MICRO
- Origin: Shenzhen Hanxia Electronic Co., Ltd
- Model: HX MICRO 6.4 JBWZ
- Certifications: UL94V-0 (for LCP plastic)
Technical Specifications
| Section | Item | Specification | Test Method/Reference Standard |
| Material Details | Plastic Part | LCP UL94V-0 | |
| Contact Terminal Part | H65, Nickel base, Gold plated contact area 1 | ||
| Shell Part | H65, Nickel base 50, Tin plated 80 | ||
| Mechanical Performance | Insertion Force | 3.0kgf MAX | Reference: EIA 364-13A (Insertion force when mating with cable end at 25mm/min) |
| Extraction Force | 0.7~1.8 kgf | Reference: EIA 364-13A (Extraction force when mating with cable end at 25mm/min) | |
| Terminal Single PIN Retention Force | 0.5 kgf MIN | Reference: EIA 364-09A (Force to withdraw contact PIN from plastic at 25mm/min) | |
| Durability Test | 3000 cycles | Reference: EIA 364-28A (Uniform insertion/extraction at 600 cycles per hour) | |
| Electrical Performance | Contact Resistance | 50m MAX | Reference: EIA 364-23A (Test contact resistance value with low power current) |
| Insulation Resistance | 100M MIN | 100V DC | |
| Withstanding Voltage Test | 300V AC 1 minute 0.5mA | Reference: EIA 364-20A (Test plastic withstand voltage between contact pins for 1 minute with 0.5mA current) | |
| Plastic Impedance between Adjacent Contact Pins | Reference: EIA 364-21A (Test plastic impedance value between adjacent contact pins) | ||
| Contact Resistance (after environmental tests) | 100m MAX | ||
| Insulation Resistance (after environmental tests) | 100M MIN | ||
| Environmental Performance | Solderability | Tin coverage 95% | Product welding area immersed in 2355 tin bath for 50.5 seconds. Reference: MIL STD-202F |
| High Temperature Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | Place product in 85 high-temperature oven for 96 hours, then place at room temperature for 3 hours for observation. Reference: MIL STD-1344A | |
| Low Temperature Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | Place product in -40 low-temperature oven for 96 hours, then place at room temperature for 3 hours for observation. Reference: MIL STD-1344A | |
| Humidity Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | Place product in an environment of 402 and 9095%RH for 120 hours, then observe. Reference: EIA 364-31A | |
| Corrosion Resistance | Appearance: No obvious corrosion. Contact Resistance: 50m MAX. | Place product in a salt spray chamber with 5% salt water concentration at 352 for continuous spray for 12 hours, then place at room temperature for 1 hour for observation. Reference: EIA 364-26A | |
| Solderability (after environmental tests) | Appearance: No obvious discoloration or blistering; Solder on solder legs is smooth. | ||
| Other | Working Current | 1 Ampere | |
| Operating Temperature | -30+80 | ||
| Vibration Test | Amplitude 1.5mm, frequency from 10Hz to 55Hz and back to 10Hz per minute, continuous testing for 2 hours in X/Y/Z directions. | Reference: EIA 364-28A |
2309141107_hanxia-HX-MICRO-6-4-JBWZ_C7502815.pdf
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