TF card external welding connector SHETIME TFW11-S1F1-2000-A with SUS201 shell and UL498 certification
Manufacturer:
SHETIME
Description:
Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS
Category:
PC Card Sockets/PC Card Sockets
Specifications
Card Connection Mode:
自弹式
Height Above Board:
2mm
Supplementary Features:
带定位柱
Card Detection:
有
Connector Type:
卡座
Card Type:
MicroSD卡(TF卡)
Mfr. Part #:
TFW11-S1F1-2000-A
Package:
SMD
Model Number:
TFW11-S1F1-2000-A
Introduction
Product Overview
This product specification defines the product performance and test methods for the T-FLASH connector, designed and manufactured by the company. It is a TF card external welding connector.
Product Attributes
- Brand: SHELL CD PAD
- Origin: Taiwan Factory: , China Factory:
- Material: HOUSING: LCP UL94-V0, CONTACT: COPPER ALLOY, SHELL: SUS201
- Certifications: UL498
Technical Specifications
| Item | Requirements | Test Methods |
|---|---|---|
| Product Confirmation | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact resistance (Low Level) | 80 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current l | |
| Mechanical & Electrical Characteristic | As described in Table I | |
| Material | Harmful material can follow the requirement of RoHS. | |
| Electroplating Specifications | NICKEL UNDERLAYER 40U" MIN, CONTACT AREA GOLD 0.5U"MIN, SOLDER LEG AREA MATTE TIN 80U"MIN. | |
| Plating | CONTACT: GOLD FLASH PLATED. SHELL: NICKEL PLATED. | |
| Electrical Characteristics | CONTACT CURRENT RATING :O.5A MAX, CONTACT RESISTANCE 100 m MAX, INSULATION RESISTANCE 5OO M MIN | |
| Solderability | Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants. | |
| Resistance to Solder Heat (SMT) | Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature. Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds. Cool Down: Cool down in ambient air at approximately 20 to 25. | |
| Resistance to Solder Heat (Infrared Reflow) | Preheat: Increase in temperature not to exceed 4 per second. Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds. Cool Down: Cool down shall not exceed 6 per second. | Device temperature measurements are referenced from the top-center of the package outer surface. |
| Cleaning | Aqueous Cleaning: Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121. | |
| Storage | Temperature: -25~+85, Relative humidity: 80%, Not to storage in corrosive environments. A re-qualification test shall be conducted immediately while the storage duration exceed 6 months. | |
| Transportation | Any vehicle can be adopted for the transportation, but moisture-proof and no mechanical damage. |
2511251735_SHETIME-TFW11-S1F1-2000-A_C52995093.pdf
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