SIM Memory Card Connector SHETIME SMP21-S1S1-2000-A Featuring Copper Alloy Contacts and Gold Finish
Manufacturer:
SHETIME
Description:
-25℃~+85℃ Push-Push 1.9mm SMD PC Card Sockets RoHS
Category:
PC Card Sockets/PC Card Sockets
Specifications
Operating Temperature:
-25℃~+85℃
Card Connection Mode:
自弹式
Rated Voltage (Max):
-
Height Above Board:
1.9mm
Supplementary Features:
-
Card Detection:
-
Connector Type:
-
Card Type:
-
Mfr. Part #:
SMP21-S1S1-2000-A
Package:
SMD
Model Number:
SMP21-S1S1-2000-A
Introduction
Product Overview
This specification covers performance, tests, and quality requirements for SIM Memory Card Connectors. These connectors are designed to provide space savings and improved functionality for system signal transfer.
Product Attributes
- Brand: DONGGUAN GYUEDA ELECTRONICS CO.,LTD
- Origin: Taiwan Factory: , China Factory:
- Materials: Contact: High performance copper alloy (Phosphor Bronze), Housing: LCP+30%G.F
- Finish: Contact Area: Gold over Nickel, Solder Tail area: Gold over Nickel
- Certifications: UL94V-0
Technical Specifications
| Test Description | Test Results | Test Conditions | Applicable Standards |
|---|---|---|---|
| Low-Signal Level Contact Resistance | R<100 m | Mated connector as shown in MIL-STD-202F, Method 302 | MIL-STD-202F, Method 302 |
| Insulation Resistance | R>1000 M | Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. | MIL-STD-202F, Method 302 |
| Dielectric Withstanding Voltage | No discharge, flashover or breakdown. | 500 V initial and 250 V final for 1 minute. | MIL-STD-202F, Method 301 |
| Retention Force | 100 Gram (0.98N) minimum (per pin) | Mate connector with a suitable gauge for each pin at rate of 25 mm/min. | MIL-STD-1344A, Method 2012.1 |
| Vibration (Discontinuity) | 1.0 microsec. MAX | Mate dummy card and subject to Vibration conditions for 2 hours in each of 3 axes. Amplitude: 1.52 mm P-P, Frequency: 10-55-10 Hz (traversed in 1 minute). | MIL STD 202 Method 201 |
| Durability | 5000 cycles. | Sample mounted in test machine at rate of 25mm/min. | MIL-STD-1344A, Method 2016 |
| Solderability | Solderable area shall have minimum of 95% solder coverage. | Subject test area of contacts into flux for 30.5 seconds and then into solder bath at 2705 for 30.5 seconds. | |
| Salt Spray | Oxidation of not more than 5% | Subject mated/unmated connectors to 51% salt-solution concentration, 352 for 24 hours. | MTL-STD-1344A, Method 1001.1 |
| Temperature Life (Heat Aging) | A. Products in 852 96 hours, can still be used normally. B. Products in 2605 (max 260) reflow, deformation not more than 0.12 mm. | A. 852 for 96 hours. B. Reflow temperature (max 260). | MTL-STD-202F, Method 108A |
2511131740_SHETIME-SMP21-S1S1-2000-A_C52750312.pdf
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