Durable SHETIME TFW13-N1S1-2020-A T Flash Connector with Visual and Functional Inspection Compliance
Manufacturer:
SHETIME
Description:
Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS
Category:
PC Card Sockets/PC Card Sockets
Specifications
Card Connection Mode:
自弹式
Height Above Board:
2mm
Supplementary Features:
带定位柱
Card Detection:
有
Connector Type:
卡座
Card Type:
MicroSD卡(TF卡)
Mfr. Part #:
TFW13-N1S1-2020-A
Package:
SMD
Model Number:
TFW13-N1S1-2020-A
Introduction
Product Specification: T-Flash type CONN. A/0
This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH. connector, which is designed and manufactured by the company. It is a T-Flash external welding type connector.
Product Attributes
- Brand:
- Taiwan Factory:
- China Factory:
- Material: Harmful material can follow the requirement of RoHS.
- Certifications: UL498 (UL standard for safety of attachment plug and receptacle)
- Origin: Taiwan & China
Technical Specifications
| Item | Requirements | Test Methods |
| 1. Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. Visually, dimensions and functionally inspected per applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| 2. Contact resistance (Low Level) | 80 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| 3. Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| 4. Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| 5. Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate c |
| 6. SOLDERABILITY | Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants. | MIL-STD-202F standard. |
| 7. RESISTANCE TO SOLDER HEAT (SMT) | Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature. Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds. Cool Down: Cool down in ambient air at approximately 20 to 25. | SMT process |
| 8. RESISTANCE TO SOLDER HEAT (INFRARED REFLOW) | Preheat: Increase in temperature not to exceed 4 per second. Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds. Cool Down: Cool down shall not exceed 6 per second. | Infrared Reflow process |
| 9. CLEANING (Aqueous Cleaning) | Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121. | Aqueous Cleaning process |
| 10. STORAGE | Temperature: -25~+85, Relative humidity: 80%, Not to storage in corrosive environments. Re-qualification test shall be conducted immediately while the storage duration exceed 6 months. | Storage conditions |
| 11. TRANSPORTATION | Any vehicle can be adopted for the transportation, but moisture-proof and no mechanical damage. | Transportation conditions |
2511251735_SHETIME-TFW13-N1S1-2020-A_C52995095.pdf
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