TFlash Connector SHETIME TFW11-S1F2-2000-A Featuring Nickel Underlayer and Matte Tin Solder Leg Area
Manufacturer:
SHETIME
Description:
Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS
Category:
PC Card Sockets/PC Card Sockets
Specifications
Card Connection Mode:
自弹式
Height Above Board:
2mm
Supplementary Features:
带定位柱
Card Detection:
有
Connector Type:
卡座
Card Type:
MicroSD卡(TF卡)
Mfr. Part #:
TFW11-S1F2-2000-A
Package:
SMD
Model Number:
TFW11-S1F2-2000-A
Introduction
T-Flash Connector
This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH connector, which is designed and manufactured by Company. This connector is suitable for applications requiring reliable data transfer and is designed to meet electrical, mechanical, and environmental performance requirements.
Product Attributes
- Brand: SHELL CD PAD (implied by logo)
- Origin: Taiwan Factory: , China Factory:
- Material: Housing: LCP UL94-V0, Contact: COPPER ALLOY, Shell: SUS201
- Certifications: UL498 (mentioned in reference documents)
Technical Specifications
| Item | Requirements | Test Methods |
|---|---|---|
| Product Description | TF | - |
| Customer Part Number | TFW1X-XXXX-X000-A | - |
| Manufacturer Part Number | TFW11-N1S1-2000-A | - |
| Housing Material | LCP UL94-V0 | - |
| Contact Material | COPPER ALLOY | - |
| Shell Material | SUS201 | |
| Electroplating Specifications | Nickel Underlayer 40U" MIN, Contact Area Gold 0.5U"MIN, Solder Leg Area Matte Tin 80U"MIN. | - |
| Plating (Contact) | Gold Flash Plated | - |
| Plating (Shell) | Nickel Plated | - |
| Contact Current Rating | 0.5A MAX | - |
| Contact Resistance | 100 m MAX | - |
| Insulation Resistance | 500 M MIN | - |
| Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact resistance (Low Level) | 80 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. | Current l |
| Storage Temperature | -25~+85 | - |
| Storage Relative Humidity | 80% | - |
2511251735_SHETIME-TFW11-S1F2-2000-A_C52995094.pdf
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