Electrical and mechanical tested SHETIME TFC6A-N1S1-2000-A TF card connector designed for surface mounting
Manufacturer:
SHETIME
Description:
Push-Push 1.8mm MicroSD Card SMD PC Card Sockets RoHS
Category:
PC Card Sockets/PC Card Sockets
Specifications
Operating Temperature:
-
Card Connection Mode:
自弹式
Rated Voltage (Max):
-
Height Above Board:
1.8mm
Supplementary Features:
-
Card Detection:
-
Connector Type:
-
Card Type:
MicroSD卡
Mfr. Part #:
TFC6A-N1S1-2000-A
Package:
SMD
Model Number:
TFC6A-N1S1-2000-A
Introduction
Product Overview
This specification defines the performance and test methods for the TFC6A-N1S1-2000-A TF card connector, designed for surface mounting. It is manufactured by DONGGUAN GAOYUEDA ELECTRONICS CO., LTD. and offers reliable electrical, mechanical, and environmental characteristics.
Product Attributes
- Brand: TAIWAN FACTORY:
- Origin: DONGGUAN GAOYUEDA ELECTRONICS CO., LTD. (China Factory), (Taiwan Factory)
- Material: Conforms to RoHS directive.
- Certifications: UL498 (Safety of attachment plug and receptacle)
Technical Specifications
| Item | Requirements | Test Methods |
| Product Confirmation | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact Resistance (Low Level) | 80 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation Resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate connector for 5000 cycles. |
| Temperature Rise | 30C Max. | Not specified in detail, implied by standard testing procedures. |
| Solderability | Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants. | Referenced MIL-STD-202F. |
| Resistance to Solder Heat (Wave Soldering) | Preheat: Not to exceed 4/sec, final preheat within 125 of solder temp. Soldering: Max 250 for 5 sec. Cool Down: Ambient air 20-25. | Specific parameters for wave soldering process. |
| Resistance to Solder Heat (Infrared Reflow) | Preheat: Not to exceed 4/sec. Soldering: Max 90 sec above 183, max 10 sec at 260. Cool Down: Not to exceed 6/sec. | Specific parameters for infrared reflow soldering process. |
| Cleaning | Connectors resist to cleaning process. Aqueous Cleaning: Max 1 min exposure to 54-66 demineralized water at max 30 psi; followed by air drying for 60-90 sec at 93-121. | Specific parameters for cleaning process. |
| Storage Conditions | Temperature: -25~+85, Relative humidity: 80%, Not to storage in corrosive environments. Re-qualification test required after 6 months. | Environmental storage requirements. |
| Transportation | Moisture-proof and no mechanical damage. | General transportation guidelines. |
2511131740_SHETIME-TFC6A-N1S1-2000-A_C52750311.pdf
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